Production Milestone Achieved on Siemens Contract

EnSilica PLC

05 February 2026

 

5 February 2026

EnSilica plc

("EnSilica", the "Company" or the "Group")

Production Tape-Out Milestone Achieved on Siemens AG Design and Supply Contract

EnSilica plc (AIM: ENSI), a leading fabless chipmaker of mixed-signal ASICs (Application Specific Integrated Circuits), is pleased to announce that the ASIC developed under the design and supply contract awarded by Siemens AG, as announced on 12 September 2024, has successfully reached the production tape-out milestone.

This milestone marks the completion of the design phase and the release of final data to the semiconductor foundry to commence manufacturing of the production tooling and first samples. It represents a significant step towards volume production of the ASIC, where production of the ASIC is scheduled to begin ramping up in January 2027, earlier than initially expected.

Ian Lankshear, Chief Executive Officer, commented:

"I would like to thank the team for their hard work and close collaboration with our customer in achieving this milestone, which is a key step on the path to full-scale production. The Company now has five chips in production and a dozen chips in its design pipeline soon progressing to tape-out, testing, qualification and into production.

This achievement is a testament to the world-class skills and dedication of our engineering and operations teams."

EnSilica plc Ian Lankshear, Chief Executive Officer Kristoff Rademan, Chief Financial Officer www.ensilica.com	via Vigo Consulting [phone]
Allenby Capital Limited (Nominated Adviser & Joint Broker) Jeremy Porter / Vivek Bhardwaj (Corporate Finance) Joscelin Pinnington / Tony Quirke (Sales & Corporate Broking)	[phone] [e-mail]
Panmure Liberum Limited (Joint Broker) Edward Mansfield / Will King	[phone]
Vigo Consulting (Investor & Financial Public Relations) Jeremy Garcia / Safia Colebrook	[phone]  [e-mail]

About EnSilica plc

EnSilica is a fabless, application-specific chipmaker, combining deep domain and system-level expertise with world-class capability in RF, mmWave, mixed-signal and complex digital IC design. The Company serves customers across the communications, industrial, automotive and healthcare markets, where safety and security and reliability are critical.

A growing portfolio of reusable IP and silicon platforms underpins a repeatable, scalable delivery model, reducing development risk, cost and time to market while supporting long-term supply revenues. EnSilica has a strong track record of delivering production-proven silicon to demanding industry standards. Headquartered near Oxford, UK, the Company operates design centres across the UK, India, Brazil and Hungary.

 

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