EU Space & Comms Centre of Excellence

Summary by AI BETAClose X

EnSilica plc is establishing a new Space & Communications Semiconductor Centre of Excellence in Milan, Italy, with plans to recruit 20 specialist modem and mmWave engineers over the next six months to expand its European Union engineering footprint. This strategic move positions the company to better engage with European space, semiconductor, and communications initiatives, complementing its existing design centres in Budapest and Munich. The Milan facility will enhance EnSilica's capabilities in modem architecture, physical-layer algorithms, digital signal processing, and mmWave communications, supporting its customer-funded ASIC programmes and ASSP developments as it aims to become a leading European provider of application-specific silicon for the growing space and communications markets.

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EnSilica PLC
08 September 2026
 

Reach announcement*

 

08 September 2026

 

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EnSilica plc

("EnSilica", the "Company" or the "Group")

 

EnSilica to open Space & Communications Semiconductor Centre of Excellence in Milan

 

Initial recruitment of 20 specialist modem and mmWave engineers

expands EnSilica's EU engineering footprint

 

EnSilica plc (AIM: ENSI), a leading chipmaker of mixed-signal application-specific integrated circuits ("ASICs") and application-specific standard products ("ASSPs"), is pleased to announce that it will be opening a new Space & Communications Semiconductor Centre of Excellence in Milan, Italy, a region which for a long time has been a central hub for the semiconductor and communication industries.

 

It is proposed that the centre will initially recruit 20 specialist modem and mmWave engineers over the next six months, expanding EnSilica's engineering presence within the European Union and positioning the Group to participate more closely in European space, semiconductor and communications initiatives. The Milan centre will be EnSilica's third site in Europe, alongside a growing design centre in Budapest, Hungary, and an expanding sales centre in Munich, Germany.

 

The centre will provide EU-based expertise spanning modem architecture, physical-layer algorithms, digital signal processing and mmWave communications systems and will work alongside EnSilica's established ASIC engineering and operations teams, which have a proven track record of delivering some of the industry's most complex chips. Together, these capabilities will strengthen EnSilica's ability to develop highly integrated application-specific silicon for next-generation space and communications markets.

 

Northern Italy semiconductor ecosystem

Milan has been selected by EnSilica for its established semiconductor, communications and space technology ecosystem. Northern Italy hosts one of Europe's largest clusters of semiconductor and communications engineering companies.

 

Italy is a significant European semiconductor nation, with a long-established base in analogue, mixed-signal and power semiconductor design and manufacturing, and is among the largest national contributors to the European space sector. Supported by leading technical universities and research institutes, the location will give EnSilica access to specialist engineering talent, proximity to customers and partners across the European supply chain, and a platform for collaborative research and EU-funded development.

 

The centre will support EnSilica's growing portfolio of customer-funded ASIC programmes and its own ASSP developments, forming part of the Group's strategy to become the leading European provider of application-specific silicon for space and satellite communications.

 

Ian Lankshear, Chief Executive Officer of EnSilica plc, commented:

 

"Milan sits within one of Europe's major semiconductor and communications ecosystems. It is therefore a natural decision to open a Space & Communications Semiconductor Centre of Excellence in Milan to expand our position within the EU. Initially recruiting 20 modem and mmWave engineers over the next six months will give us the specialist capability at both the systems and semiconductor level to support the existing pipeline. Overall, this investment will strengthen our EU engineering footprint and advance our ambition to make EnSilica the leading European supplier of application-specific silicon for the rapidly growing space and communications markets."

 

Follow EnSilica

 

Investors looking to engage with EnSilica's management team and receive the latest Company news and invitations to investor presentations and events are encouraged to sign up to the link below:

 

https://www.ensilica.com/investors/regulatory-news/

 

 

For further information please contact:

 

EnSilica plc

Ian Lankshear, Chief Executive Officer

Kristoff Rademan, Chief Financial Officer

www.ensilica.com

via Novella Communications

+44 (0)20 3151 7008  

 

 

Allenby Capital Limited (Nominated Adviser & Joint Broker)

Jeremy Porter / Vivek Bhardwaj (Corporate Finance)

Joscelin Pinnington / Tony Quirke (Sales & Corporate Broking)

 

 

+44 (0)20 3328 5656

info@allenbycapital.com

 

 


Panmure Liberum Limited (Joint Broker)

Edward Mansfield / Will King / Zak Wadud

 

+44 (0)20 3100 2000

 

 

 

Novella Communications (Investor & Financial Public Relations)

Tim Robertson / Oliver Norton

 

+44 (0)20 3151 7008  

ensilica@novella-comms.com

 

 

 

About EnSilica plc

 

EnSilica is a fabless, application-specific chipmaker, combining deep domain and system-level expertise with world-class capability in RF, mmWave, mixed-signal and complex digital IC design. The Company serves customers across the space and communications, industrial, and automotive markets, where safety, security and reliability are critical.

 

A growing portfolio of reusable IP and silicon platforms underpins a repeatable, scalable delivery model, reducing development risk, cost and time to market while supporting long-term supply revenues. EnSilica has a strong track record of delivering production-proven silicon to demanding industry standards. Headquartered near Oxford, UK, the Company operates design centres across the UK, India, Brazil and Hungary.

 

LEI: 213800R6VXRU7MJTAF04

 

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