SAWsense investment to accelerate scale-up

Transense Technologies PLC

22 April 2026

 

RNS Reach - non-regulatory announcement

Transense Technologies plc

("Transense" or the "Company")

Transense accelerates SAWsense scale-up with precision equipment investment

Transense Technologies plc, a leading innovator in sensor technology and measurement systems, has taken delivery of a bespoke, high-precision die bonding machine to support the commercial scale-up of its SAWsense division.

The £0.4m investment in this new machine marks a key step towards developing high-volume production processes for customers requiring highly repeatable sensor installations at scale and takes the capital investment for the pilot SAW sensor installation line to more than £1m. This investment programme has been funded by internally generated cash flow, augmented by an asset backed financing facility to provide additional headroom.

Transense's patented Surface Acoustic Wave (SAW) technology is used to measure torque, force and temperature in safety and performance-critical applications, particularly in demanding environments such as robotics, aerospace, automotive, electric drive systems, and motorsport. The new equipment enables micron-level precision placement of SAW sensing elements onto shafts and other components, delivering consistent, repeatable installations suitable for high-volume production.

SAWsense designs, supplies and licenses advanced SAW-based sensor solutions to leading aerospace, automotive and industrial customers, including GE Aerospace, Motion Applied and Airbus, alongside other confidential OEM and Tier 1 customers.

The purchase follows an 18-month development programme, including trials at Newcastle University's Driving the Electric Revolution Industrialisation Centre (DER-IC) to define a production-ready process.

The automated die bonder, based on commercially available equipment commonly used in semiconductor packaging, provides the accuracy and flexibility required for prototyping and high-mix production, and demonstrates process capability for future high-volume manufacturing from hundreds of thousands to millions of units per year.

Ryan Maughan, Managing Director at Transense Technologies plc, commented: "This investment marks an important milestone for SAWsense as we transition from development into scalable manufacturing capability.

"As demand for our wireless, passive sensing technology continues to grow globally, we aim to accelerate the adoption of SAWsense technology across multiple high-value sectors and support our customers' successful adoption of the technology into their products.

"The new precision die bonding platform enables highly repeatable placement of our SAW sensor elements and provides the foundation for high-volume production process development to meet growing demand from robotics, aerospace and automotive customers. This is not just new equipment, it's a crucial step toward scalable revenue, reduced adoption barriers, and the possibility of meaningful volume contracts across multiple high-value sectors."

For further information please visit www.transense.com or contact:

Transense Technologies plc Nigel Rogers (Executive Chairman) Ryan Maughan (Managing Director) Melvyn Segal (Chief Financial Officer)

Via Investor Relations (see below)

ENDS

Media contact: Amy Maughan MCIPR. E: [e-mail] / Tel: [phone].

Investor Relations: Anice McNamee E: [e-mail] / Tel: [phone] / Website: www.transense.com.

Notes to editors: Transense Technologies plc is a UK-based developer of advanced sensor systems for industrial and automotive applications. Through its SAWsense and Translogik business divisions, the company delivers innovative technology for measuring torque, temperature and tyre performance in demanding environments. Transense is listed on the AIM market of the London Stock Exchange (AIM: TRT). The company is headquartered in Oxfordshire.

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