XSemi carves out IC and SiC
Subject: XSemi carves out IC and SiC product lines to speed up Hon Hai and YAGEO's strategic partnership on semiconductor development
Date of events:2023/05/31
Contents:
1.Date of occurrence of the event:2023/05/31
2.Company name: XSemi Corporation
3.Relationship with the Company (please enter "the company itself" or "subsidiaries"):subsidiaries
4.Reciprocal shareholding percentage:51% before adjustment; 45% after adjustment
5.Name of the reporting media: Press release of the Company
6.Content of the report:
Hon Hai Technology Group (TWSE: 2317 TW; "Hon Hai") and YAGEO Group today jointly announced that XSemi Corporation ("XSemi"), the semiconductor joint venture of the two companies, will transfer its IC (integrated circuit) and SiC (Silicon Carbide) product and module business to Hon Hai's newly set up IC design subsidiary for an all-cash consideration of NT$204 million. Along with the transaction, the two major shareholders will adjust the shareholding structure of XSemi with YAGEO and Hon Hai holding 55% and 45%, respectively, of XSemi shares.
7.Cause of occurrence: Clarification on the press release of the Company
8.Countermeasures: None
9.Any other matters that need to be specified: None
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