Edge AI ASIC Supply Contract Completes Tape-Out

EnSilica PLC

11 June 2026

 

This announcement contains inside information for the purposes of Article 7 of the Market Abuse Regulation (EU) 596/2014 as it forms part of UK law by virtue of the European Union (Withdrawal) Act 2018 ("MAR") and is disclosed in accordance with the Company's obligations under Article 17 of MAR

11 June 2026

EnSilica plc

("EnSilica", the "Company" or the "Group")

Edge AI ASIC Supply Contract Completes Tape-Out

Customer forecast indicates this chip will become one of the largest revenue generating contracts in EnSilica's portfolio

EnSilica plc (AIM: ENSI), a leading fabless microchip maker with a growing portfolio of reusable IP, serving the Space & Comms, Industrial, Automotive and Healthcare markets, is pleased to announce that the Edge AI application-specific integrated circuit ("ASIC") supply contract, as first announced on 15 July 2024, has successfully completed production tape-out, releasing the US$5m NRE and tape-out fee to be recognised across FY2026 and FY2027.

Next Steps

Achieving production tape-out represents a major milestone for this supply contract, marking the completion of the design phase and testing and the transition to the manufacture of production tooling and initial samples. Progress on the supply contract has been led by the customer's schedule, with first silicon samples anticipated in 2026 and volume production expected to begin during calendar year 2027.

The Edge-AI supply contract is expected to become a significant revenue contributor to the Group of up to an estimated US$50 million over five years once full-scale production commences.

Portfolio

With the completion of the Edge AI production tape-out:

·    three additional ASICs are now expected to join the five ASICs currently in volume production over the next 18 months; and

·    a further eleven active ASIC and ASSP (application specific standard product) programmes continue to progress through their respective design and development phases.

This expanding portfolio reflects the strengthening of both EnSilica's recurring semiconductor supply revenues and its long-term growth prospects as more programmes transition from design and development into production.

Edge AI - a growth market

Edge AI refers to artificial intelligence processing performed locally within devices or systems, rather than in centralised cloud computing facilities. This approach enables faster decision-making, improved privacy, reduced communications bandwidth and lower power consumption, making it increasingly attractive for the Space & Comms, Industrial, Automotive and Healthcare markets.

Consequently, Edge AI is one of the most significant growth areas within the semiconductor industry and this supply contract demonstrates EnSilica's ability to service the requirements of these highly complex ASIC solutions into emerging high-value markets.

Ian Lankshear, Chief Executive Officer, commented:

"I would like to thank our team for their hard work and close collaboration with our customer in achieving this milestone, which is a key step on the path to full-scale production of our first chip within the significant growth market of Edge AI processing.

With five chips already in production and a substantial pipeline of programmes advancing towards production, we are very visibly building a growing portfolio of valuable long-term ASIC supply revenues."

For further information please contact:

EnSilica plc Ian Lankshear, Chief Executive Officer Kristoff Rademan, Chief Financial Officer www.ensilica.com	via Novella Communications [phone]
Allenby Capital Limited (Nominated Adviser & Joint Broker) Jeremy Porter / Vivek Bhardwaj (Corporate Finance) Joscelin Pinnington / Tony Quirke (Sales & Corporate Broking)	[phone] [e-mail]
Panmure Liberum Limited (Joint Broker) Edward Mansfield / Will King / Phoebe Bunce	[phone]
Novella Communications (Investor & Financial Public Relations) Tim Robertson / Oliver Norton	[phone]   [e-mail]

About EnSilica plc

EnSilica is a fabless, application-specific chipmaker, combining deep domain and system-level expertise with world-class capability in RF, mmWave, mixed-signal and complex digital IC design. The Company serves customers across the space and communications, industrial, automotive and healthcare markets, where safety, security and reliability are critical.

A growing portfolio of reusable IP and silicon platforms underpins a repeatable, scalable delivery model, reducing development risk, cost and time to market while supporting long-term supply revenues. EnSilica has a strong track record of delivering production-proven silicon to demanding industry standards. Headquartered near Oxford, UK, the Company operates design centres across the UK, India, Brazil and Hungary.

LEI: 213800R6VXRU7MJTAF04

 

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