
Investor Newsletter
Celebrating 25 Years of Innovation and Growth
June 2026

This year marks an important milestone as EnSilica celebrates its 25th anniversary.
Founded in May 2001, the Company has evolved from a specialist ASIC design consultancy into an international semiconductor company with operations across the UK, Hungary, Germany, India and Brazil. Over the last quarter century, EnSilica has built world-class expertise in mixed-signal, RF, communications, automotive, industrial and security semiconductors, delivering hundreds of successful chip developments for customers worldwide.
Today, EnSilica is increasingly benefiting from the strategic transition made over recent years from a design services business towards a semiconductor company with a growing portfolio of proprietary products and long-term chip supply contracts. These multi-year contracts carry greater revenue visibility and a growing base of recurring revenue, strengthening the quality and predictability of the Company's future earnings.
Ian Lankshear, Chief Executive Officer, commented:
"As we celebrate our 25th anniversary, I would like to thank our employees, customers, partners and shareholders who have supported EnSilica throughout our journey. The foundations we have built over the past 25 years are enabling exciting opportunities in satellite communications, photonics, automotive and industrial markets, providing a strong platform for future growth."
AST SpaceMobile continues to advance its vision of delivering broadband connectivity directly to ordinary smartphones from space. Recent industry developments, including growing support from major mobile network operators, reinforce the potential for direct-to-device services to become a significant new communications market.
In its latest milestone, AST SpaceMobile has scheduled the launch of three next-generation BlueBird satellites for 17 June 2026, aboard a SpaceX Falcon 9 from Cape Canaveral, having recently secured US regulatory authorisation to provide direct-to-device cellular broadband nationwide.
EnSilica was selected in 2021 to support the development of a next-generation custom ASIC for AST SpaceMobile's space-based cellular broadband network, which is designed to work with everyday smartphones.
EnSilica has deep experience in advanced satellite-communication semiconductors and continues to see growing opportunities across both satellite payload and user-terminal markets as demand for non-terrestrial networks accelerates. As this large and fast-growing market scales, engagements like these have the potential to convert into long-term, high-volume silicon supply revenue.
Artificial Intelligence is creating unprecedented demand for data-centre performance and energy efficiency.
Recently, Oriole Networks announced deployment of what it describes as the world's first large-scale pure photonic AI network, developed in collaboration with AMD as part of the UK's ARIA Scaling Inference Lab. The technology uses optical networking to move data using light rather than electrical signals, significantly reducing power consumption while improving utilisation of AI infrastructure.
EnSilica is developing a photonics controller ASIC for Oriole and is engaged with additional photonics opportunities as AI-driven demand for high-speed optical networking continues to grow. As an early-stage design partner, EnSilica is well positioned to scale this engagement into volume production supply as AI infrastructure investment expands, representing a substantial potential new revenue stream.
Alongside these emerging growth markets, EnSilica continues to build a substantial portfolio of long-term semiconductor supply programmes.
A highlight during the year was the award of a new $75 million multi-year automotive semiconductor supply contract with a leading European Tier-1 supplier, adding to a portfolio that now includes more than 10 million automotive ASICs shipped and multiple long-term automotive and industrial supply programmes. On the industrial side, EnSilica supplies custom ASICs to Siemens, a leading global industrial OEM.
These programmes demonstrate the Company's growing ability to convert engineering expertise into recurring semiconductor supply revenues, underpinning a growing contracted order book and improving long-term revenue visibility. Automotive qualification cycles are long and demanding, creating high barriers to entry and typically resulting in multi-year programme lifecycles once a design is secured.
As EnSilica enters its next chapter, the Company remains focused on building Europe's premier application-specific semiconductor company and on translating its expanding portfolio of design wins into sustainable revenue growth and long-term value for shareholders.
The Board remains encouraged by:
· Growing, recurring semiconductor supply revenues and an expanding contracted order book.
· Expanding opportunities in the large and fast-growing satellite communications and space markets.
· Emerging photonics and AI infrastructure engagements addressing rapidly growing demand.
· Strong automotive and industrial traction with multi-year programme visibility.
· A robust pipeline of future ASIC opportunities to support long-term revenue growth.
The Company looks forward to updating shareholders on further progress throughout 2026.
For the latest company news, view EnSilica's RNS announcements and register for email alerts and updates.
About EnSilica plc
EnSilica is a fabless, application-specific chipmaker, combining deep domain and system-level expertise with world-class capability in RF, mmWave, mixed-signal and complex digital IC design. The Company serves customers across the space and communications, industrial, automotive and healthcare markets, where safety, security and reliability are critical.
A growing portfolio of reusable IP and silicon platforms underpins a repeatable, scalable delivery model, reducing development risk, cost and time to market while supporting long-term supply revenues. EnSilica has a strong track record of delivering production-proven silicon to demanding industry standards. Headquartered near Oxford, UK, the Company operates design centres across the UK, India, Brazil and Hungary.
LEI: 213800R6VXRU7MJTAF04
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