New contracts with existing customers worth $3.6m

RNS Number : 2968J

EnSilica PLC

12 December 2022

 

Prior to publication, the information contained within this announcement was deemed by the Group to constitute inside information for the purposes of Regulation 11 of the Market Abuse (Amendment) (EU Exit) Regulations 2019/310. With the publication of this announcement, this information is now considered to be in the public domain.

12 December 2022

EnSilica plc

("EnSilica", the "Company" or the "Group")

EnSilica secures two new contracts with existing customers worth $3.6m

EnSilica, a leading mixed signal chip maker, is pleased to announce that it has secured two new contracts, from existing customers based in mainland Europe, for a combined total of $3.6 million.

The contracts, which underpin current market expectations, include incremental workflows with a major automotive Tier 1 customer, with both contracts expected to commence by January 2023.

One of the contracts is to develop a TSMC ¹ 12 nm FinFet ² chip, which the Company's engineering team at its new Bristol design centre will help deliver, utilising Flow IP ³ methodologies and software routines acquired from Blu Wireless Technology in July this year. 

Ian Lankshear, Chief Executive Officer of EnSilica plc, commented:

"We are delighted to have secured a further two contracts from existing customers, which has enabled our team to take full advantage of our recently acquired Flow IP capabilities.  Pleasingly, these new design flows will enable us to deliver both high quality and highly competitive complex chips to our customers.

With the global demand for new chip development strong, EnSilica remains ideally placed to continue to take full advantage of these market opportunities."

Definitions:

¹ TSMC Taiwan Semiconductor Manufacturing Company

² FinFET FIN Field Effect Transistor: A three-dimensional transistor architecture that uses a raised channel (the "fin") from source to drain. FinFETs replaced CMOS for technology nodes smaller than 20 nm.

³ Flow IP includes documented methodologies and software routines for design chips. They verify incoming or outgoing data quality and automate complex and repetitive tasks. They create differentiation as they are refined from learning from each chip design and improve design efficiency.

For further information please contact:

EnSilica plc Ian Lankshear, Chief Executive Officer Matthew Wethey, Chief Financial Officer www.ensilica.com	Via Vigo Consulting [phone]
Allenby Capital Limited, Nominated Adviser & Broker Jeremy Porter / Vivek Bhardwaj (Corporate Finance) Joscelin Pinnington/Tony Quirke (Sales & Corporate Broking)	[phone] [e-mail]
Vigo Consulting (Investor & Financial Public Relations) Jeremy Garcia	[phone] [e-mail]

About EnSilica

EnSilica is a leading fabless design house focused on custom ASIC design and supply for OEMs and system houses, as well as IC design services for companies with their own design teams. The company has world-class expertise in supplying custom RF, mmWave, mixed signal and digital ICs to its international customers in the automotive, industrial, healthcare and communications markets. The company also offers a broad portfolio of core IP covering cryptography, radar and communications systems. EnSilica has a track record in delivering high quality solutions to demanding industry standards. The company is headquartered near Oxford, UK and has design centres across the UK and in India and Brazil.

 

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